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Supermicro BigTwin™ Solutions

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  • BigTwin™ is the First and Only 2U Multi-Node System supporting the highest performance 205 watt processors, full 24 DIMMs of memory, 24 All-Flash NVMe Drives and an industry leading 30% better thermal capacity - optimized for today and future proofed for the next generation of technology breakthroughs.

    1. No-compromise 5th Generation Twin architecture delivers the highest performance and efficiency in a 2U 4-node platform.

    2. The first and only multi-node system that supports the widest TDP range of CPUs (up to 205 watts), fully exploits all memory channels with 24 DIMMS per node and 24 All-Flash NVMe drives

    3. 30% better thermal capacity in a compact 2U form factor enables configurations with the highest performance processor, memory, storage and I/O leveraging the Titanium level 96% efficient PowerStick power supplies (2200W/2600W).

    4. Double the I/O capacity with three PCI-E 3.0 x16 options per node and added flexibility with more than 10 networking options including 2x 1GbE, 10G, 25G,100G, IB and industry leading SIOM modular interconnect

    5. Each node can support current and next generation dual Intel Xeon processors with up to 3TB of memory, 24 drives of All-Flash NVMe, Hybrid NVMe/SATA/SAS, SSD and HDD, plus 2 m.2 NVMe per node

TOTAL : 15

SYS-6028BT-HNC0R+NEW

  • Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s
  • Up to 3TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 24 DIMM slots
  • 2 PCI-E 3.0 x16 (LP) slots; 1 SIOM card support (flexible networking) Note: must bundle with Network card
  • 3 Hot-swap 3.5" NVMe/SAS3 drive bays
  • SAS3 support via Broadcom 3008; IT mode
  • IPMI 2.0 + KVM with dedicated LAN
  • Video via Aspeed AST2400 BMC
  • 4 heavy duty 8cm PWM fans with air shroud
  • 2200W Redundant Power Supplies Titanium Level (96%)
  • 2 M.2 SATA3 or NVMe support

SYS-2028BT-HNC1R+NEW

  • Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s
  • Up to 3TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 24 DIMM slots
  • 1 PCI-E 3.0 x16 (LP) slot; 1 SIOM card support (flexible networking) Note: must bundle with Network card
  • IPMI 2.0 + KVM with dedicated LAN
  • 6 SAS3 or 4 NVMe + 2 SAS3 Hot-swap 2.5" drive bays
  • SAS3 support via Broadcom 3108; HW RAID 0, 1, 5, 6, 10, 50, 60
  • Video via Aspeed AST2400 BMC
  • 4 heavy duty 8cm PWM fans with air shroud
  • 2200W Redundant Power Supplies Titanium Level
  • 2 M.2 Cards support

SYS-2028BT-HNR+NEW

  • Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s
  • Up to 3TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 24x DIMM slots
  • 2 PCI-E 3.0 x16 (LP) slots; 1 SIOM card support (flexible networking) Note: must bundle with Network card
  • IPMI 2.0 + KVM with dedicated LAN
  • 6 Hot-swap 2.5" NVMe drive bays
  • Video via Aspeed AST2400 BMC
  • 4x 8cm heavy duty PWM fans with air shroud
  • 2200W Redundant Power Supplies Titanium Level
  • 2 M.2 Cards support

SYS-2028BT-HNC0R+NEW

  • Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s
  • Up to 3TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 24x DIMM slots
  • 2 PCI-E 3.0 x16 (LP) slots; 1 SIOM card support (flexible networking) Note: must bundle with Network card
  • IPMI 2.0 + KVM with dedicated LAN
  • 6 SAS3 or 4 NVMe + 2 SAS3 Hot-swap 2.5" drive bays
  • SAS3 support via LSI 3008; RAID 0, 1, 10
  • Video via Aspeed AST2400 BMC
  • 4x 8cm heavy duty PWM fans with air shroud
  • 2200W Redundant Power Supplies Titanium Level
  • 2 M.2 Cards support

SYS-2028BT-HTR+NEW

  • Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s
  • Up to 3TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 24x DIMM slots
  • 2 PCI-E 3.0 x16 (LP) slots; 1 SIOM card support (flexible networking) Note: must bundle with Network card
  • IPMI 2.0 + KVM with dedicated LAN
  • 6 Hot-swap 2.5" SATA3 drive bays
  • Video via Aspeed AST2400 BMC
  • 4x 8cm heavy duty PWM fans with air shroud
  • 2200W Redundant Power Supplies Titanium Level

SYS-2029BT-HNTR

  • 1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, Dual UPI up to 10.4GT/s
  • 2. Up to 3TB ECC 3DS L/RDIMM, up to DDR4-2666MHz; 24 DIMM slots
  • 3. 2 PCI-E 3.0 x16 (LP) slots; 1 SIOM card support (flexible networking) Note: must bundle with Network card
  • 4. IPMI 2.0 + KVM with dedicated LAN
  • 5. 4 Hot-swap 2.5" NVMe/SATA3 + 2 Hot-swap 2.5" SATA3 drive bays; 1 M.2 SATA3 or NVMe support
  • 6. Video via Aspeed AST2500 BMC
  • 7. 4 Heavy duty 8cm PWM fans with air shroud
  • 8. 2200W Redundant Power Supplies Titanium Level (96%)

SYS-2029BZ-HNRNEW

  • 1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, 3 UPI up to 10.4GT/s
  • 2. Up to 3TB ECC 3DS L/RDIMM, up to DDR4-2666MHz; 24 DIMM slots
  • 3. 2 PCI-E 3.0 x16 (LP) slot; 1 SIOM card support (flexible networking) Note: must bundle with Network card
  • 4. IPMI 2.0 + KVM with dedicated LAN
  • 5. 6 Hot-swap 2.5" NVMe drive bays; 2 M.2 SATA3 or NVMe support
  • 6. Video via Aspeed AST2500 BMC
  • 7. 16 Heavy duty 40x56mm fans with optimal fan speed control (4 fans per node)
  • 8. 2600W Redundant Power Supplies Titanium Level (96%)

SYS-2029BT-HNC1R

  • 1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, Dual UPI up to 10.4GT/s
  • 2. Up to 3TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 24 DIMM slots
  • 3. 1 PCI-E 3.0 x16 (LP) slot; 1 SIOM card support (flexible networking) Note: must bundle with Network card
  • 4. IPMI 2.0 + KVM with dedicated LAN
  • 5. 6 SAS3 or 4 NVMe + 2 SAS3 Hot-swap 2.5" drive bays; 2 M.2 SATA3 or NVMe support
  • 6. SAS3 support via Broadcom 3108; RAID 0, 1, 5, 6, 10, 50, 60
  • 7. Video via Aspeed AST2500 BMC
  • 8. 4 Heavy duty 8cm PWM fans with air shroud
  • 9. 2200W Redundant Power Supplies Titanium Level (96%)

SYS-2029BT-HNRNEW

  • 1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, Dual UPI up to 10.4GT/s
  • 2. Up to 3TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 24 DIMM slots
  • 3. 2 PCI-E 3.0 x16 (LP) slot; 1 SIOM card support (flexible networking) Note: must bundle with Network card
  • 4. IPMI 2.0 + KVM with dedicated LAN
  • 5. 6 Hot-swap 2.5" NVMe drive bays; 2 M.2 SATA3 or NVMe support
  • 6. Video via Aspeed AST2500 BMC
  • 7. 4 Heavy duty 8cm PWM fans with air shroud
  • 8. 2200W Redundant Power Supplies Titanium Level (96%)

SYS-2029BT-HNC0R

  • 1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, Dual UPI up to 10.4GT/s
  • 2. Up to 3TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 24 DIMM slots
  • 3. 2 PCI-E 3.0 x16 (LP) slot; 1 SIOM card support (flexible networking) Note: must bundle with Network card
  • 4. IPMI 2.0 + KVM with dedicated LAN
  • 5. 6 SAS3 or 4 NVMe + 2 SAS3 Hot-swap 2.5" drive bays; 2 M.2 SATA3 or NVMe support
  • 6. SAS3 support via Broadcom 3008; IT mode
  • 7. Video via Aspeed AST2500 BMC
  • 8. 4 Heavy duty 8cm PWM fans with air shroud
  • 9. 2200W Redundant Power Supplies Titanium Level (96%)

SYS-2029BT-HTRNEW

  • 1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, Dual UPI up to 10.4GT/s
  • 2. Up to 3TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 24 DIMM slots
  • 3. 2 PCI-E 3.0 x16 (LP) slot; 1 SIOM card support (flexible networking) Note: must bundle with Network card
  • 4. IPMI 2.0 + KVM with dedicated LAN
  • 5. 6 Hot-swap 2.5" SATA3 drive bays
  • 6. Video via Aspeed AST2500 BMC
  • 7. 4 Heavy duty 8cm PWM fans with air shroud
  • 8. 2200W Redundant Power Supplies Titanium Level (96%)

SYS-2029BT-DNR

  • 1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, Dual UPI up to 10.4GT/s
  • 2. Up to 3TB ECC 3DS RDIMM/LRDIMM, up to DDR4-2666MHz; 24 DIMM slots
  • 3. 2 PCI-E 3.0 x8 slot, 1 PCI-E 3.0 x16, 1 SIOMcard support (flexible networking) Note: must bundle with Network card
  • 4. IPMI 2.0 + KVM with dedicated LAN
  • 5. 12 Hot-swap 2.5" NVMe drive bays; 2 internal M.2 NVMe/SATA slots
  • 6. Video via Aspeed AST2500 BMC
  • 7. 4 Heavy duty 8cm PWM fans with air shroud
  • 8. 2200W Redundant Power Supplies Titanium Level (96%)

SYS-2029BT-DNC0RNEW

  • 1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, Dual UPI up to 10.4GT/s
  • 2. Up to 3TB ECC 3DS RDIMM/LRDIMM, up to DDR4-2666MHz; 24 DIMM slots
  • 3. 2 PCI-E 3.0 x8 slot, 1 PCI-E 3.0 x16, 1 SIOMcard support (flexible networking) Note: must bundle with Network card
  • 4. 4 NVMe/SAS3 + 8 SAS3 Hot-swap 2.5" drive bays; 2 internal M.2 NVMe/SATA slots
  • 5. SAS3 support via Broadcom 3216; IT mode
  • 6. IPMI 2.0 + KVM with dedicated LAN
  • 7. Video via Aspeed AST2500 BMC
  • 8. 4 Heavy duty 8cm PWM fans with air shroud
  • 9. 2200W Redundant Power Supplies Titanium Level (96%)

SYS-6029BT-DNC0RNEW

  • 1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, Dual UPI up to 10.4GT/s
  • 2. Up to 3TB ECC 3DS L/RDIMM, up to DDR4-2666MHz; 24 DIMM slots
  • 3. 2 PCI-E 3.0 x8 slot, 1 PCI-E 3.0 x16, 1 SIOMcard support (flexible networking) Note: must bundle with Network card
  • 4. 6 SAS3 or 3 NVMe + 3 SAS3 Hot-swap 3.5" drive bays, 2 internal M.2 NVMe/SATA slots
  • 5. SAS3 support via Broadcom 3008; IT mode
  • 6. IPMI 2.0 + KVM with dedicated LAN
  • 7. Video via Aspeed AST2500 BMC
  • 8. 4 Heavy duty 8cm PWM fans with air shroud
  • 9. 2200W Redundant Power Supplies Titanium Level (96%)

SYS-6029BT-HNC0RNEW

  • 1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, Dual UPI up to 10.4GT/s
  • 2. Up to 3TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 24 DIMM slots
  • 3. 2 PCI-E 3.0 x16 (LP) slot; 1 SIOM card support (flexible networking) Note: must bundle with Network card
  • 4. 3 Hot-swap 3.5" NVMe/SAS3 drive bays; 2 M.2 SATA3 or NVMe support
  • 5. SAS3 support via Broadcom 3008; IT mode
  • 6. IPMI 2.0 + KVM with dedicated LAN
  • 7. Video via Aspeed AST2500 BMC
  • 8. 4 Heavy duty 8cm PWM fans with air shroud
  • 9. 2200W Redundant Power Supplies Titanium Level (96%)
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