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Available Colors :
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Key Features
- Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following:
- Dual socket R (LGA 2011) supports Intel® Xeon® processor E5-2600 v3 family; QPI up to 9.6GT/s
- Up to 1TB ECC LRDIMM, 512GB ECC RDIMM, up to 2133MHz; 16x DIMM sockets
- 1x PCI-E 3.0 x16 Low-profile slot; 1x "0 slot" (x16)
- Single port IB (FDR, 56Gbps), w/ QSFP connector
- Intel® i350-AM2 Dual port GbE LAN
- Integrated IPMI 2.0 with KVM and Dedicated LAN
- 3x 3.5" Hot-swap SATA HDD Bays
- 2000W Redundant Power Supplies Titanium Level (96%)
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Parts List - (Items Included) | |||
Part Number | Qty | Description | |
Motherboard / Chassis | MBD-X10DRT-PIBF CSE-827HQ+-R2K04B |
4 1 |
Super X10DRT-PIBF Motherboard 2U Chassis |
Backplane | BPN-SAS3-827HQ | 1 | 12x 3.5" hard drive backplane; supports 3.5" Twin Pro Chassis; SAS-3 12Gb/s compliance, new Molex 64-pin receptacles, PWM fan control and Power delay control on HDD spin up,RoHS/REACH,PBF |
Backplane | BPN-ADP-6SATA3P | 4 | Backplan adapter card; 6SATA ports,RoHS/REACH,PBF |
Riser Card | RSC-R1UTP-E16R | 4 | ,RoHS/REACH,PBF |
Heatsink / Retention | SNK-P0047PSM | 4 | 1U Passive Front CPU Heat Sink w/ a Middle Air Channel for X9, X10 2U Twin^2+ and Twin Pro^2 Series Servers |
Heatsink / Retention | SNK-P0057PS | 4 | 1U High Performance Passive CPU Heat Sink for X9, X10 Systems Equipped w/ a Narrow ILM MB |
Power Supply | PWS-2K04A-1R or PWS-2K02P-1R |
2 | 2000W Redundant Titanium Level Power Supplies or 2000W Redundant Platinum Level Power Supplies |
Optional Parts List | |||
Part Number | Qty | Description | |
Onsite Service Program | OS4HR3/2/1 | - | 3/2/1-year onsite 24x7x4 service |
Onsite Service Program | OSNBD3/2/1 | - | 3/2/1-year onsite NBD service |
Software | SFT-OOB-LIC | 4 | OOB Management Package (per node license) |
Software | SFT-DCMS-Single | 4 | DataCenter Management Package (per node license) |