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Available Colors :
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Key Features
- Two hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following:
- Dual socket R (LGA 2011) supports Intel® Xeon® processor E5-2600 v3 family; QPI up to 9.6GT/s
- Up to 1TB ECC LRDIMM, 512GB ECC RDIMM, up to 2133MHz; 16x DIMM sockets
- 1x PCI-E 3.0 x16, 1x PCI-E 3.0 x8 slots
- Single port IB (FDR, 56Gbps), w/ QSFP connector
- Intel® i350-AM2 Dual port GbE LAN
- Integrated IPMI 2.0 with KVM and Dedicated LAN
- 6x 3.5" Hot-swap drive bays (Up to 4x NVMe + 2x SAS3 or 6x SAS3)
- LSI 3008 SAS3 controller (8 ports); RAID 0, 1, 10
- 1600W Redundant Power Supplies Titanium Level Digital (96%)
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Parts List - (Items Included) | |||
Part Number | Qty | Description | |
Motherboard / Chassis | MBD-X10DRT-PIBF CSE-827HD+-R1K68B |
2 1 |
Super X10DRT-PIBF Motherboard 2U Chassis |
Backplane | BPN-ADP-8S3008N4-2UP | 2 | 2U adapter card for 2U TwinPro system; LSI3008 on board to provide 8x SAS3 ports, 4x NVMe ports, 1x mSATA port and 1x SATADOM port,HF,RoHS/REACH |
Backplane | BPN-SAS3-827HD-N4 | 1 | Backplane for TwinPro with support up to 4x 3.5" SAS3/SATA3 HDD/SSD and 8x SAS3/SATA3/NVMe Storage Devicse. Each node supports up to 2xSAS3/SATA3 HDD/SSD and 4 SAS3/SATA3/NVMe devices,HF,RoHS/REACH |
Heatsink / Retention | SNK-P0048PS | 4 | 2U Passive CPU Heat Sink for X9, X10 Generation Systems Equipped w/ a Narrow ILM MB |
Power Supply | PWS-1K68A-1R | 2 | 1U 1600W Redundant Titanium Power Supply 76mm width 27Pair,PBF |
Optional Parts List | |||
Part Number | Qty | Description | |
Onsite Service Program | OS4HR3/2/1 | - | 3/2/1-year onsite 24x7x4 service |
Onsite Service Program | OSNBD3/2/1 | - | 3/2/1-year onsite NBD service |
Software | SFT-OOB-LIC | 2 | OOB Management Package (per node license) |
Software | SFT-DCMS-Single | 2 | DataCenter Management Package (per node license) |