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Key Features
- 1.Intel® Xeon® Scalable Processors, Single Socket P (LGA 3647) supported, CPU TDP support 205W
- 2.Intel® C622 chipset
- 3.Up to 1TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 8x DIMM slots
- 4.Expansion slots: 1 PCI-E 3.0 x16 (x16 || x8), 1 PCI-E 3.0 x8 (x0 || x8), 1 PCI-E 3.0 x8, 1 PCI-E 3.0 x4 (in x8)
- 5.2 10G SFP+
- 6.10 SATA3 (6Gbps) via C622
- 7.8 SAS3 (12Gbps) via Broadcom® 3008; RAID 0, 1, 10
- 8.2x Port NVMe PCI-E 3.0 x4 via OCuLink
- 9.5 USB 3.0 (2 rear, 1 Type-A, 2 via header), 8 USB 2.0 (2 rear, 6 via headers)
- 10.M.2 NGFF connector M.2 Interface: PCI-E 3.0 x4 and SATA Form Factor: 2280 Key: M-Key Double Height Connector
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Parts List (Bulk Package) | |||
Name | Part Number | Qty | Description |
Motherboard | MBD-X11SPH-nCTPF | 1 | X11SPH-nCTPF Motherboard |
I/O Cables | CBL-0044L | 2 | 57.5 cm SATA FLAT S-S PBF |
I/O Shield | MCP-260-00109-0N | 1 | STD I/O Shield for X11SPH-nCTPF with EMI Gasket |
Parts List (Retail Package) | |||
Name | Part Number | Qty | Description |
Motherboard | MBD-X11SPH-nCTPF | 1 | X11SPH-nCTPF Motherboard |
QRG | MNL-1949-QRG | 1 | Motherboard Quick Reference Guide |
I/O Cables | CBL-0044L | 2 | 57.5 cm SATA FLAT S-S PBF |
I/O Shield | MCP-260-00109-0N | 1 | STD I/O Shield for X11SPH-nCTF with EMI Gasket |
Chassis (Optimized for X11SPH-nCTPF) |
Embedded Compact | 1U | 2U | 3U | Mid/Mini-Tower | 4U/Tower |
826BE1C-R802LPB 216BE1C4-R1k23LPB 823MTQC-R802LPB 825MBTQC-R802LPB 2U Heatsink:SNK-P0068APS4 |
SC836BE1C-R1K23B | SC847BE1C4-R1K23LPB SC846BE1C-R1K23B 2U Heatsink:SNK-P0068APS4 |
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Blue color = Compatible | ||
Green color = Global SKU & Compatible | ||
Red dot & green color = Optimized + Global SKU |