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Key Features
- 2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors. Dual Socket P (LGA 3647) supported, CPU TDP support 165W, 2 UPI up to 10.4 GT/s
- Intel® C621
- Up to 3TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 3TB 3DS ECC LRDIMM, DDR4-2933MHz, in 12 DIMM slots;
Up to 2TB Intel® Optane DC Persistent Memory in memory mode (Cascade Lake only); - 1 PCI-E 3.0 x16 Left Riser Slot,
1 PCI-E 3.0 x16 Right Riser Slot
M.2 Interface: 2 SATA/PCI-E 3.0 x4, RAID 0 & 1
M.2 Form Factor: 2260/2280/22110
M.2 Key: M-Key
U.2 Interface: 4 PCI-E 3.0 x4,
4 PCI-E 3.0 NVMe x4 Internal Port(s) - 1 VGA port
- Intel® C621 controller for SATA3 (6 Gbps) ports; RAID 0,1,5,10
- Single LAN with
Networking options provided via SIOM module
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Parts List (Bulk Package) | |||
Motherboard | Part Number | Qty | Description |
Motherboard | MBD-X11DPFF-SN | 1 | X11DPFF-SN Motherboard |
Optional Parts List | |||
Name | Part Number | Qty | Description |
TPM security module(optional, not included) | AOM-TPM-9670V | 1 | SPI capable TPM 2.0 with Infineon 9670 controller with vertical form factor |
TPM security module(optional, not included) | AOM-TPM-9670H | 1 | SPI capable TPM 2.0 with Infineon 9670 controller with horizontal form factor |
TPM security module(optional, not included) | AOM-TPM-9671V | 2 1 |
SPI capable TPM 1.2 with Infineon 9670 controller with vertical form factor |
TPM security module(optional, not included) | AOM-TPM-9671H | 1 | SPI capable TPM 1.2 with Infineon 9670 controller with horizontal form factor |
Server(Optimized for X11DPFF-SN) |
Server Name |
SYS-F619P2-FT SYS-F619P3-FT SYS-F619H6-FT |