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Form Factor |
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Dimensions |
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12" x 13" (30.48cm x 33.02cm)
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CPU |
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Intel® Xeon® Scalable Processors.
- Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
- CPU1: Skylake-F CPU supporte
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Cores / Cache |
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Memory Capacity |
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Up to 2TB 3DS ECC RDIMM and DDR4-2666MHz, Up to 2TB 3DS ECC LRDIMM, in 16 DIMM slots
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Memory Type |
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2666/2400/2133MHz ECC DDR4 RDIMM, LRDIMM
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DIMM Sizes |
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RDIMM: 64GB
- LRDIMM: 64GB
- 3DS LRDIMM: 128GB
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Memory Voltage |
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Error Detection |
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Corrects single-bit errors
- Detects double-bit errors (using ECC memory)
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Chipset |
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SATA |
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Intel® C622 controller for 14 SATA3 (6 Gbps) ports; RAID 0,1,5,10
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IPMI |
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Network Controllers |
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Dual LAN with 10GBase-T with Intel® X722 + X557
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Graphics |
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USB |
- 2 USB 2.0 ports (2 rear),
- 5 USB 3.0 ports (2 rear + 2 via header(s) + 1 Type A)
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Video Output |
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Serial Port / Header |
- 2 COM Ports (1 rear, 1 header(s))
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TPM |
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PCI-E |
- 4 PCI-E 3.0 x16,
- 2 PCI-E 3.0 x8
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M.2 |
- Interface: PCIe 3.0 x4
- Form Factor: 2260, 2280, 22110
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Software |
- Intel® Node Manager, IPMI2.0, KVM with dedicated LAN, SPM, SSM, SUM, SuperDoctor® 5, Watchdog
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Voltage |
- +1.8V, +12V, +3.3V, +5V, +5V standby
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FAN |
- 8x 4-pin fan headers (up to 8 fans), Pulse Width Modulated (PWM) fan connectors, PWM fan speed control
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Temperature |
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LED |
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Other Features |
- Chassis intrusion detection, CPU thermal trip support for processor protection, Node Manager Support, RoHS
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Operating Temperature Range |
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0°C ~ 50°C (32°F ~ 122°F)
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Non-Operating Temperature Range |
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-20°C ~ 60°C (-4°F ~ 140°F)
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Operating Relative Humidity Range |
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10% ~ 85% (non-condensing)
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Non-Operating Relative Humidity Range |
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10% ~ 95% (non-condensing)
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