-
-
Key Features
- Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v3 family; QPI up to dual 9.6GT/s
- Intel® C612 chipset
- Up to 1.5TB ECC DDR4 2133MHz; 24x DIMM slots
- 2 PCI-E 3.0 x16, 1 PCI-E 3.0 x8 1 PCI-E 3.0 x8 for SAS3 Add-On-Module
- SIOM for flexible networking options
- 4x SATA3 (6Gbps); RAID 0, 1, 5, 10
- Integrated IPMI 2.0 and KVM with Dedicated LAN
- 3x USB 3.0 (2 rear, 1 Type A)
- 4x Port NVMExpress PCI-E 3.0 x4 via OCuLink
|
|
Partxs List (Bulk) | |||
Part Number | Qty | Description | |
X10DSC+ | MBD-X10DSC+ | 1 | X10DSC+ Motherboard |
Optional Parts List | |||
Part Number | Qty | Description | |
Heat Sink (optional, not included) |
- | - | CPU Heat Sink reference |
TPM security module (optional, not included) |
AOM-TPM-9655V AOM-TPM-9655H |
- | TPM module with Infineon 9655, RoHS/REACH,PBF; Vertical or Horizontal depends on the server |
SuperDOM | - | - | Supermicro SATA DOM Solutions ] |
AOM | AOM-S3108M-H8L | - | SAS3 HW RAID Mezzanine card |