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Integrated Board
Available Colors :
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Key Features
- 8 Hot-plug System Nodes in 4U
- Each node supports:
- Dual Socket P (LGA 3647) support 2nd Gen. Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡
- 12 DIMMs; up to 3TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM††
- Expansion slots: 1 PCI-E 3.0 x16 (LP)
1 PCI-E 3.0 x16 (for SIOM ) - 6 Hot-swap 2.5" SAS3/SATA3 or 2 Hot-swap 2.5" SAS3/SATA3 + 4 optional NVMe U.2
M.2 Interface: PCI-E 3.0 x4
M.2 Form Factor: 2260, 2280, 22110
M.2 Key: M-Key - SAS3 via Broadcom 3108, HW RAID
- SIOM Network card,
1 dedicated IPMI LAN port - 1 VGA, 2 USB 3.0 ports
- 3x 4cm 20k RPM middle fans
- 2200W Redundant Power Supplies Titanium Level (96% Efficiency)
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