Home제품정보 Super Server New!Tower/4UDP XeonFatTwin Intel® Xeon® Scalable New!

SYS-F619P2-RT

견적상담제품문의

Integrated Board

X11DPFR-S

Available Colors : Black

Key Features
  • 8 Hot-plug System Nodes in 4U
  • Each node supports:
  1. Dual Socket P (LGA 3647) support 2nd Gen. Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡
  2. 12 DIMMs; up to 3TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM††
  3. Expansion slots: 1 PCI-E 3.0 x16 (LP) 1 PCI-E 3.0 x16 (for SIOM )
  4. 6 Hot-swap 2.5" SATA3 drive bays
    M.2 Interface: PCI-E 3.0 x4
    M.2 Form Factor: 2260, 2280, 22110
    M.2 Key: M-Key
  5. SIOM Network card,
    1 dedicated IPMI LAN port
  6. 1 VGA, 2 USB 3.0 ports
  7. 3x 4cm 20k RPM middle fans
  8. 2200W Redundant Power Supplies Titanium Level (96% Efficiency)

Global SKUs Digital Power 80 PLUS

Product SKUs
SYS-F619P2-RT
  • SuperServer F619P2-RT (Black)
 
Motherboard


Super X11DPFR-S
 
Processor/Cache (per Node)
CPU
  • Dual Socket P (LGA 3647)
  • 2nd Gen. Intel® Xeon® Scalable Processors (Cascade Lake/Skylake)‡,

    Dual UPI up to 10.4GT/s
  • Support CPU TDP 70-165W with IVR
Cores
  • Up to 28 Cores
Note ‡ BIOS version 3.0a or above is required to support 2nd Gen. Intel® Xeon® Scalable processors
 
System Memory (per Node)
Memory Capacity
  • 12 DIMM slots
  • Up to 3TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM
  • Supports Intel® Optane™ DCPMM††
Memory Type
  • 2933†/2666/2400/2133MHz ECC DDR4 RDIMM/LRDIMM
Note † 2933MHz in two DIMMs per channel can be achieved by using memory purchased from Supermicro

†† Cascade Lake only. Contact your Supermicro sales rep for more info.
 
On-Board Devices
Chipset
  • Intel® C621 chipset
SATA
  • SATA3 (6Gbps); RAID 0, 1, 5, 10
Network Controllers
  • Flexible networking via SIOM
IPMI
  • Support for Intelligent Platform Management Interface v.2.0
  • IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
Graphics
  • ASPEED AST2500 BMC
 
Input / Output (per node)
SATA
  • 14 SATA3 (6Gbps) ports
LAN
  • SIOM flexible Network card
  • 1 RJ45 Dedicated IPMI LAN port
USB
  • 2 USB 3.0 ports (rear)
VGA
  • 1 VGA port
 
System BIOS
BIOS Type
  • 128Mb SPI Flash EEPROM with AMI BIOS
 
Management
Software
Power Configurations
  • ACPI Power Management
 
PC Health Monitoring
CPU
  • Monitors for CPU Cores, Chipset Voltages, Memory.
  • 4+1 Phase-switching voltage regulator
FAN
  • Fans with tachometer monitoring
  • Status monitor for speed control
  • Pulse Width Modulated (PWM) fan connectors
Temperature
  • Monitoring for CPU and chassis environment
  • Thermal Control for fan connectors
Chassis
Form Factor
  • 4U Rackmount
Model
  • CSE-F418BC2-R2K20BP
 
Dimensions and Weight
Width
  • 17.63" (448mm)
Height
  • 6.96" (177mm)
Depth
  • 29" (737mm)
Package
  • 28.3" (W) x 15.0" (H) x 42.4" (D)
Weight
  • Net Weight: 150 lbs (68.04 kg)
  • Gross Weight: 200 lbs (90.71 kg)
Available Colors
  • Black
 
Front Panel
Buttons
  • Power On/Off button
  • UID button
LEDs
  • Power status LED
  • Hard drive activity LED
  • Network activity LEDs
  • Information LED (UID, Fan failure, Overheat)
 
Expansion Slots (per node)
PCI-Express
  • 1 PCI-E 3.0 x16 (Low-profile)
  • 1 PCI-E 3.0 x16 (SIOM)
 
Drive Bays (per node)
Hot-swap
  • 6 Hot-swap 2.5" SATA3 drive bays
M.2
  • M.2 Interface: PCI-E 3.0 x4
  • M.2 Form Factor: 2260, 2280, 22110
  • M.2 Key: M-Key
 
Backplane
1 SAS/SATA backplane
 
System Cooling (per node)
Fans
  • 3x 4cm 20k RPM middle fans
 
Power Supply
2200W Redundant Power Supplies with PMBus
Total Output Power and Input
  • 1200W with Input 100-127Vac
  • 1800W with Input 200-220Vac
  • 1980W with Input 220-230Vac
  • 2090W with Input 230-240Vac
  • 2200W with Input 220-240Vac (for UL/cUL use only)
  • 2090W with Input 230-240Vdc (for CCC only)
AC Input Frequency
  • 50-60Hz
Dimension

(W x H x L)
  • 76 x 40 x 336 mm
+12V
  • Max: 100A / Min: 0A (100-127Vac)
  • Max: 150A / Min: 0A (200-220Vac)
  • Max: 165A / Min: 0A (220-230Vac)
  • Max: 174.17A / Min: 0A (230-240Vac)
  • Max: 183.3A / Min: 0A (220-240Vac)
5VSB
  • Max: 1A / Min: 0A
Output Type
  • Backplanes (gold finger)
Certification Titanium Level96%  Titanium Level

  [ Test Report ]
 
Operating Environment
RoHS
  • RoHS Compliant
Environmental Spec.
  • Operating Temperature:

       10°C ~ 35°C (50°F ~ 95°F)
  • Non-operating Temperature:

       -40°C to 60°C (-40°F to 140°F)
  • Operating Relative Humidity:

       8% to 90% (non-condensing)
  • Non-operating Relative Humidity:

       5% to 95% (non-condensing)


Parts List - (Items Included)
 

 Part Number

 Qty

 Description
Motherboard / Chassis MBD-X11DPFR-S

CSE-F418BC2-R2K20BP 		8

1		 Super X11DPFR-S Motherboard

4U Chassis
Backplane BPN-ADP-X11DPFR 8 Power distribution board for X11DPFR-S(N)
Backplane BPN-SAS-F418-B6 8 6-port Fat Twin 6Gbps hot swappable HDD backplane (W/O SGPIO), support up to 6x 2.5-inch SAS/SATA HDD
Cable 1 CBL-0486L 16 2x2 to 2x2 15cm power cable HF. 18AWG
Cable 2 CBL-OTHR-0022L 8 20 to 20 pin cable for BPN-ADP-F418LS,7.5cm, 28AWG,RoHS/REACH,PBF
Cable 3 CBL-PWCD-0578 4 PWCD,US,IEC60320 C14 TO C13,3FT,14AWG
Cable 4 CBL-SAST-0616 8 MINI SAS HD-4 SATA,6G,INT,50CM,50CM SB,30AWG
Cable 5 CBL-SAST-1003-1 8 MINI SAS HD to 2X SATA,SB,INT,55 CM
Riser Card RSC-RR1U-E16 8 RSC-RR1U-E16 with PIC-E x16 output
Heatsink / Retention SNK-P0067PS 8 1U Passive CPU Heat Sink for X11 Purley Platform Equipped with a Narrow Retention Mechanism
Heatsink / Retention SNK-P0067PSM 8 1U Passive CPU Heat Sink with a 26-mm Wide Middle Air Channel for X11 Purley Platform Equipped with a Narrow Retention Mechanism
Power Supply PWS-2K20A-1R 4 1U 2200W Redundant, Titanium, 76(W) X 40(H) X 336(L) mm




Optional Parts List
  Part Number Qty Description
Software SFT-OOB-LIC • 1 OOB Management Package (per node license)
Software SFT-DCMS-Single 1 DataCenter Management Package (per node license)