Integrated Board

X11DPT-PS

Available Colors :

Key Features
  • Compute Intensive Application
  • HPC, Data Center
  • Enterprise Server
  • Financial Analysis
  • Mission-critical applications
  1. Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following:
  2. Dual Socket P (LGA 3647) support 2nd Gen. Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡
  3. 16 DIMMs; up to 4TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM††
  4. 2 PCI-E 3.0 x16 (LP) slots
  5. Flexible Networking support via SIOM; Dedicated IPMI 2.0 LAN
  6. 6 Hot-swap 2.5" SAS/SATA drive bays
  7. Broadcom 3008 SAS3 controller; RAID 0, 1, 10
  8. Mini-mSATA (half size) support on 3008 backplane
  9. Up to 2200W Redundant Power Supplies Titanium Level (96%)

Digital Power 80 PLUS

Product SKUs
SYS-2029TP-HC0R
  • SuperServer 2029TP-HC0R (Black)
 
Motherboard (Four per System)


Super X11DPT-PS
 
Processor/Cache (per Node)
CPU
  • Dual Socket P (LGA 3647)
  • 2nd Gen. Intel® Xeon® Scalable Processors (Cascade Lake/Skylake),

    Dual UPI up to 10.4GT/s
  • Support CPU TDP 70-165W*
Cores
  • Up to 28 Cores
Note * Please contact Supermicro Technical Support for supporting conditions of high power (TDP 150W and above) or high base frequency (3.0 GHz and above) processors.

Note BIOS version 3.0a or above is required to support 2nd Gen. Intel® Xeon® Scalable processors
 
System Memory (per Node)
Memory Capacity
  • 16 DIMM slots
  • Up to 4TB 3DS ECC DDR4-2933MHz RDIMM/LRDIMM
  • Supports Intel® Optane™ DCPMM††
Memory Type
  • 2933/2666/2400/2133MHz ECC DDR4 RDIMM/LRDIMM
Note 2933MHz in two DIMMs per channel can be achieved by using memory purchased from Supermicro

†† Cascade Lake only. Contact your Supermicro sales rep for more info.
 
On-Board Devices (per Node)
Chipset
  • Intel® C621 chipset
SAS
  • Broadcom 3008 SAS3 (12Gbps) controller;

       RAID 0, 1, 10 support
Network Controllers
  • Barebones and Complete System must have at least one SIOM or network card installed per node
IPMI
  • Support for Intelligent Platform Management Interface v.2.0
  • IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
Graphics
  • ASPEED AST2500 BMC
 
Input / Output (per Node)
SAS
  • 6 SAS3 (12Gbps) ports
LAN
  • 1 RJ45 Dedicated IPMI LAN port
USB
  • 2 USB 3.0 ports (rear)
VGA
  • 1 VGA port
Serial Port / Header
  • 1 Fast UART 16550 port / 1 Header (internal)
Others
  • 2 SuperDOM support on the motherboard
  • 1 NVMe or 2 SATA M.2 (22x80/60/42 mm) support with option part: AOC-SMG3-2H8M2
  • M.2 and SuperDOM are for OS boot and they cannot coexist
 
System BIOS
BIOS Type
  • AMI 32MB SPI Flash ROM
 
Management
Software
Power Configurations
  • ACPI Power Management
 
PC Health Monitoring
CPU
  • Monitors for CPU Cores, Chipset Voltages, Memory.
  • 5+1 Phase-switching voltage regulator
FAN
  • Fans with tachometer monitoring
  • Status monitor for speed control
  • Pulse Width Modulated (PWM) fan connectors
Temperature
  • Monitoring for CPU and chassis environment
  • Thermal Control for fan connectors
Omni-Path Fabric CPUs
  • Do not support
Chassis
Form Factor
  • 2U Rackmount
Model
  • CSE-217HQ+-R2K20BP3
 
Dimensions and Weight
Width
  • 17.25" (438mm)
Height
  • 3.47" (88mm)
Depth
  • 28.5" (724mm)
Weight
  • Gross Weight: 90 lbs (40.9kg)
  • Net Weight: 72 lbs (32.7 kg)
Available Colors
  • Black
 
Front Panel
Buttons
  • Power On/Off button
  • UID button
LEDs
  • Power status LED
  • HDD activity LED
  • Network activity LEDs
  • Universal Information (UID) LED
 
Expansion Slots (per Node)
PCI-Express
  • 2 PCI-E 3.0 x16 Low-profile slots
  • 1 SIOM card support



    Note: Barebones and Complete System must bundle with Network Card




  • (With only one CPU installed, SXB2 M.2 and SXB4 riser card slots not function)
 
Drive Bays (per Node)
Hot-swap
  • 6 Hot-swap 2.5" SAS/SATA HDD trays
 
System Cooling
Fans
  • 4 Heavy duty 8cm PWM fans with optimal fan speed control
 
Power Supply
2200W Redundant Power Supplies with PMBus
Total Output Power and Input
  • 1200W with Input 100-127Vac
  • 1800W with Input 200-220Vac
  • 1980W with Input 220-230Vac
  • 2090W with Input 230-240Vac
  • 2200W with Input 220-240Vac (for UL/cUL use only)
  • 2090W with Input 230-240Vdc (for CCC only)
AC Input Frequency
  • 50-60Hz
Dimension

(W x H x L)
  • 76 x 40 x 336 mm
+12V
  • Max: 100A / Min: 0A (100-127Vac)
  • Max: 150A / Min: 0A (200-220Vac)
  • Max: 165A / Min: 0A (220-230Vac)
  • Max: 174.17A / Min: 0A (230-240Vac)
  • Max: 183.3A / Min: 0A (220-240Vac)
5VSB
  • Max: 1A / Min: 0A
Output Type
  • Backplanes (gold finger)
Certification Titanium Level96%  Titanium Level

  [ Test Report ]
 
Operating Environment
RoHS
  • RoHS Compliant
Environmental Spec.
  • Operating Temperature:

       10°C ~ 35°C (50°F ~ 95°F)
  • Non-operating Temperature:

       -40°C to 60°C (-40°F to 140°F)
  • Operating Relative Humidity:

       8% to 90% (non-condensing)
  • Non-operating Relative Humidity:

       5% to 95% (non-condensing)


Parts List - (Items Included)
 

Part Number

Qty

Description

Motherboard / Chassis MBD-X11DPT-PS

CSE-217HQ+-R2K20BP3
4

1
Super X11DPT-PS Motherboards

2U Chassis
Backplane BPN-ADP-S3008L-L6IP 4 LSI 3008, SAS 12Gbs (X6 port inside)
Backplane BPN-SAS3-217HQ2 1 2U 24-Port 4-Node Backplane Supports 6x2.5
Cable 1 CBL-PWCD-0578 2 PWCD,US,IEC60320 C14 TO C13,3FT,14AWG
Air Shroud MCP-310-21707-0B 4 SC217HQ+ TwinPro 2pcs air shroud set for X11 DPT-PS
Riser Card RSC-P-6 4 RSC-P-6 (1U LHS TwinPro RSC with 1 PCI-Ex16),RoHS
Riser Card RSC-R1UTP-E16R 4 1U RHS TwinPro Riser card with one PCI-E x16 slot
Heatsink / Retention SNK-P0067PS 4 1U Passive CPU Heat Sink for X11 Purley Platform Equipped with a Narrow Retention Mechanism
Heatsink / Retention SNK-P0067PSM 4 1U Passive CPU Heat Sink with a 26-mm Wide Middle Air Channel for X11 Purley Platform Equipped with a Narrow Retention Mechanism
Power Supply PWS-2K20A-1R 2 1U 2200W Redundant, Titanium, 76(W) X 40(H) X 336(L) mm




Optional Parts List
  Part Number Qty Description
TPM security module (optional, not included) AOM-TPM-9670V 1 SPI capable TPM 2.0 with Infineon 9670 controller with vertical form factor
TPM security module (optional, not included) AOM-TPM-9671V 1 SPI capable TPM 1.2 with Infineon 9670 controller with vertical form factor
Add-on-Card AOC-SMG3-2H8M2

FST-SCRW-0121L
- AOC supports 2280 M.2 form factor SSD (1 NVMe or 2 SATA)

Plastic M.2 standoff, one for each AOC-SMG3-2H8M2
Global Services & Support OS4HR3/2/1

OSNBD3/2/1
-

-
3/2/1-year onsite 24x7x4 service

3/2/1-year onsite NBD service
Software SFT-OOB-LIC 1 OOB Management Package (per node license)
Software SFT-DCMS-Single 1 DataCenter Management Package (per node license)