Integrated Board

X11DPT-PS

Available Colors :

Key Features
  • Mission-critical applications
  • High Availability Storage Appliance Platform
  • Two hot-pluggable systems(nodes) in a 1U form factor. Each nod supports the following:
  1. Dual Socket P (LGA 3647) support 2nd Gen. Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡
  2. 16 DIMMs; up to 4TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM
  3. 2 PCI-E 3.0 x16 slots
  4. Flexible Networking support via SIOM; Dedicated IPMI 2.0 LAN
  5. 4 Hot-swap 2.5" SATA3 drive bays
  6. 2 SuperDOM onboard or optional 2 M.2 carrier
  7. Up to 1000W Redundant Power Supplies Titanium Level (96%)

Digital Power 80 PLUS

Product SKUs
SYS-1029TP-DTR
  • SuperServer 1029TP-DTR (Black)
 
Motherboard (Two per System)

Super X11DPT-PS
 
Processor/Cache (per Node)
CPU
  • Dual Socket P (LGA 3647)
  • 2nd Gen. Intel® Xeon® Scalable Processors (Cascade Lake/Skylake),
    Dual UPI up to 10.4GT/s
  • Support CPU TDP 70-145W
Cores
  • Up to 28 Cores
Note BIOS version 3.0a or above is required to support 2nd Gen. Intel® Xeon® Scalable processors
 
System Memory (per Node)
Memory Capacity
  • 16 DIMM slots
  • Up to 4TB 3DS ECC DDR4-2933MHz RDIMM/LRDIMM
Memory Type
  • 2933/2666/2400/2133MHz ECC DDR4 RDIMM/LRDIMM
Note 2933MHz in two DIMMs per channel can be achieved by using memory purchased from Supermicro
 
On-Board Devices (per Node)
Chipset
  • Intel® C621 chipset
SATA
  • SATA3 (6Gbps); RAID 0, 1, 5, 10
Network Controllers
  • Barebones and Complete System must have at least one SIOM card installed per node
IPMI
  • Support for Intelligent Platform Management Interface v.2.0
  • IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
Graphics
  • ASPEED AST2500 BMC
 
Input / Output (per Node)
SATA
  • 4 SATA3 (6Gbps) ports
LAN
  • 1 RJ45 Dedicated IPMI LAN port
USB
  • 2 USB 3.0 ports (rear)
VGA
  • 1 VGA port
Serial Port / Header
  • 1 Fast UART 16550 port / 1 Header (internal)
Others
  • 2 SuperDOM support on the motherboard
  • 1 NVMe or 2 SATA M.2 (22x80/60/42 mm) support with option part: AOC-SMG3-2H8M2
  • M.2 and SuperDOM are for OS boot and they cannot coexist
 
System BIOS
BIOS Type
  • AMI 32MB SPI Flash ROM
 
Management
Software
Power Configurations
  • ACPI Power Management
 
PC Health Monitoring
CPU
  • Monitors for CPU Cores, Chipset Voltages, Memory.
  • 4+1 Phase-switching voltage regulator
FAN
  • Fans with tachometer monitoring
  • Status monitor for speed control
  • Pulse Width Modulated (PWM) fan connectors
Temperature
  • Monitoring for CPU and chassis environment
  • Thermal Control for fan connectors
Chassis
Form Factor
  • 1U Rackmount
Model
  • CSE-809H-R1K05P3
 
Dimensions and Weight
Width
  • 17.2" (437mm)
Height
  • 1.7" (88mm)
Depth
  • 28.25" (718mm)
Package
  • 29.6" (W) x 8" (H) x 38.4" (L)
Weight
  • Gross Weight: 48.1 lbs (21.9 kg)
  • Net Weight: 33.5 lbs (15.2 kg)
 
Front Panel
Buttons
  • Power On/Off button
  • UID button
LEDs
  • Power status LED
  • HDD activity LED
  • Network activity LEDs
  • Universal Information (UID) LED
 
Expansion Slots (per Node)
PCI-Express
  • 2 PCI-E 3.0 x16 Low-profile slots
  • 1 SIOM card support

    Note: Barebones and Complete System must bundle with SIOM


  • (With only one CPU installed, SXB2 M.2 and SXB4 riser card slots not function)
 
Drive Bays (per Node)
Hot-swap
  • 4 Hot-swap 2.5" SAS3/SATA3 drive bays
 
Backplane
SAS3 backplane
 
System Cooling
Fans
  • 3 Heavy duty counter rotating fans with air shroud and optimal fan speed control
 
PowerStick Power Supply
1000W 1U Redundant Power Supplies with PMBus
Total Output Power
  • 800W/1000W
Dimension
(W x H x L)
  • 38 x 40 x 360 mm
Input
  • 100-127Vac / 9-7.5A / 50-60Hz
  • 200-240Vac / 6-5A / 50-60Hz
+12V
  • Max: 66.7A / Min: 0A (100-127Vac)
  • Max: 83A / Min: 0A (200-240Vac)
+5Vsb
  • Max: 4A / Min: 0A
Output Type
  • Gold Finger Connector (16 Power Pin, 14 Signal Pin)
Certification Titanium Level Certified96%   Titanium Level
  [ Test Report ]
 
Operating Environment
RoHS
  • RoHS Compliant
Environmental Spec.
  • Operating Temperature:
       10°C ~ 35°C (50°F ~ 95°F)
  • Non-operating Temperature:
       -40°C to 60°C (-40°F to 140°F)
  • Operating Relative Humidity:
       8% to 90% (non-condensing)
  • Non-operating Relative Humidity:
       5% to 95% (non-condensing)

Parts List - (Items Included)
 
Part Number
Qty
Description
Motherboard / Chassis MBD-X11DPT-PS
CSE-809H-R1K05P3
2
1
Super X11DPT-PS Motherboards
1U Chassis
Backplane BPN-ADP-6SATA3P 2 Backplan adapter card; 6SATA ports,RoHS/REACH,PBF
Backplane BPN-SAS3-809H 1 8-port 1U TwinPro SAS3 12Gbps (4 drives per node) backplane, support up to 8x 2.5-inch SAS3/SATA3 HDD/SSD
Cable 1 CBL-PWCD-0900 2 PWCD,US/EU/Canada/China/Australia,IEC60320 C14 TO C13,4FT,17AWG
Manual MNL-2112-QRG 1 1029TP-DTR/DC0R/DC1R Quick Reference Guide
Riser Card RSC-P-6 2 RSC-P-6 (1U LHS TwinPro RSC with 1 PCI-Ex16),RoHS
Riser Card RSC-R1UTP-E16R 2 1U RHS TwinPro Riser card with one PCI-E x16 slot
Heatsink / Retention SNK-P0067PS 2 1U Passive CPU Heat Sink for X11 Purley Platform Equipped with a Narrow Retention Mechanism
Heatsink / Retention SNK-P0067PSM 2 1U Passive CPU Heat Sink with a 26-mm Wide Middle Air Channel for X11 Purley Platform Equipped with a Narrow Retention Mechanism
Power Supply PWS-1K05A-1R 2 1U 1000W Redundant Power Supply Titanium, 38X40X360mm length


Optional Parts List
  Part Number Qty Description
TPM security module (optional, not included) AOM-TPM-9670V 1 SPI capable TPM 2.0 with Infineon 9670 controller with vertical form factor
TPM security module (optional, not included) AOM-TPM-9671V 1 SPI capable TPM 1.2 with Infineon 9670 controller with vertical form factor
Carrier Card AOC-SMG3-2H8M2
FST-SCRW-0121L
- AOC supports 2280 M.2 form factor SSD (1 NVMe or 2 SATA)
Plastic M.2 standoff, one for each AOC-SMG3-2H8M2
Global Services & Support OS4HR3/2/1
OSNBD3/2/1
-
-
3/2/1-year onsite 24x7x4 service
3/2/1-year onsite NBD service
Software SFT-OOB-LIC 1 OOB Management Package (per node license)
Software SFT-DCMS-Single 1 DataCenter Management Package (per node license)